High Performance Flip Chip Process Technologies

High Performance Flip Chip Process Technologies

by Daniel Baldwin
3/5

Covers the lowcost flip chip processes and material systems that make the manufacture of miniature consumer electronic devices possible.

This title aims to help you understand and utilize the flip chip technology.

Format
500 pages, Hardcover
First published
July 13, 2008
Publishers
McGraw-Hill Professional
Subjects
Electronics engineering·Technology·Engineering·Technology·Industrial arts·Science·Mathematics·Electricity·Electronics·Circuits·General·Engineering·Electrical·Electronic·Technology·Electronics·Circuits·Printed
Language
English

Daniel Baldwin

About Daniel Baldwin

Actor and producer from the United States...

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